Electronic component manufacturing apparatus and electronic component manufacturing method

摘要

An electronic component manufacturing method includes the steps of preparing at least one electronic component chip having a first surface and a second surface opposite each other; holding the electronic component chip between a first plate and a second plate such that the first surface is in contact with a first elastic layer of the first plate and the second surface is in contact with a second elastic layer of the second plate; and turning the electronic component chip by relatively moving the first and second plates in a planar direction thereof using a planar movement mechanism and moving the first and second plates in accordance with a turning path of the electronic component chip using the planar movement mechanism and a vertical movement mechanism.

主权项

1. An electronic component manufacturing method operatively associated with an electronic component manufacturing apparatus, the method comprising the steps of:
providing the apparatus including a first plate having a first elastic layer on one side thereof, a second plate having a second elastic layer on one side thereof, a planar movement mechanism configured to relatively move the first and second plates in a planar direction thereof in a state where at least one electronic component chip adhering, at one surface thereof, to the first elastic layer is held between the first and second elastic layers facing each other, and a vertical movement mechanism configured to move, in conjunction with the planar movement mechanism, at least one of the first and second plates in the planar direction and a vertical direction in accordance with a turning path of the electronic component chip turned between the first and second elastic layers, wherein the second elastic layer is in contact with a first ridge of the electronic component chip located at a rear of an end surface of the electronic component chip, with respect to a travel direction of the second plate during turning of the electronic component chip, and the turning path of the electronic component chip determined by the planar movement mechanism and the vertical movement mechanism is a path drawn by a second ridge of the electronic component chip located diagonally opposite the first ridge of the electronic component chip, when the electronic component chip is turned by the planar movement mechanism and the vertical movement mechanism about the first ridge of the electronic component chip; preparing at least one electronic component chip including a first surface and a second surface opposite to each other; holding the electronic component chip between the first and second plates such that the first and second surfaces are in contact with the first and second elastic layers, respectively; and turning the electronic component chip by relatively moving the first and second plates in the planar direction using the planar movement mechanism and moving the first and second plates in accordance with a turning path of the electronic component chip using the planar movement mechanism and the vertical movement mechanism.