发明名称 Apparatus and method for melting and dispensing thermoplastic material
摘要 An apparatus for melting and dispensing thermoplastic material is provided that includes an un-heated hopper having an inlet for receiving particles of a thermoplastic material and an outlet for discharging the particles and a heated manifold including at least one cavity formed therein and having an inlet and an outlet the inlet communicating with the outlet of the hopper for receipt of the particles from the hopper. The hopper is disposed external of the heated manifold. The heated manifold is effective for melting the particles into molten thermoplastic material therein. The apparatus further includes a pump having an inlet in fluid communication with the cavity. An outlet of the pump is in fluid communication with an inlet of a dispenser and an outlet of the dispenser is effective for dispensing the molten thermoplastic material therethrough.
申请公布号 US9427766(B2) 申请公布日期 2016.08.30
申请号 US201314021424 申请日期 2013.09.09
申请人 NORDSON CORPORATION 发明人 Varga Leslie J.
分类号 B05C9/14;B05C5/00;B05C5/02;B29B13/02;B05B12/00;E06B3/96 主分类号 B05C9/14
代理机构 Baker & Hostetler LLP 代理人 Baker & Hostetler LLP
主权项 1. An apparatus for melting and dispensing thermoplastic material, the apparatus comprising: a chamber for receiving particles of thermoplastic material in a flow of air, said chamber including an upper portion and a lower portion, said upper portion including an inlet for receiving the particles of thermoplastic material, said upper portion further including a vent for exhausting the air from the upper portion, said upper portion being unheated and thermally insulated from said lower portion by providing at least one element at least partially defining the chamber and made from a material having low thermal conductivity; and a heated device coupled to said lower portion of said chamber and configured to receive the particles of thermoplastic material from the lower portion for liquefying the particles of thermoplastic material, and heat transmitted from said heated device to said lower portion is not transferred by conduction to said upper portion of said chamber as a result of being thermally insulated from said lower portion.
地址 Westlake OH US