发明名称 LAPPING MACHINING METHOD AND UNIT FOR LAPPING MACHINING
摘要 PROBLEM TO BE SOLVED: To machine a large and long matter to be worked by a comparatively small lapping surface plate by moving a center of the lapping surface plate having a diameter determined to be more than specific times of a long plane width and shorter than a long plane length, along a longitudinal central line of the long plane. SOLUTION: A lapping surface plate 43 having a diameter D above 1.2 times of a width B of a long plane 57a and shorter than a length of the long plane 57a, is used. A Z-axis slider is moved along a Y-axis slider, whereby the lapping surface plate 43 is pressed to the long plane 57a of a matter to be worked 57 by the predetermined pressure. Then the lapping surface plate 43 is rotated in a state that the long plane 57a of the matter to be worked 57 is coated with the slurry composed of the abrasive grain and the lap oil, and the lapping surface plate 43 is moved along the long plane 57a to execute the lapping machining.
申请公布号 JP2000117625(A) 申请公布日期 2000.04.25
申请号 JP19980287557 申请日期 1998.10.09
申请人 KURODA PRECISION IND LTD 发明人 NATSU HISASHI
分类号 B24B37/005;B24B37/10 主分类号 B24B37/005
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