| 摘要 |
PROBLEM TO BE SOLVED: To obtain a chemical machinery grinding device for obtaining high throughput, and also having the layout of a small installation area, a frontage in particular. SOLUTION: This grinding device is equipped with: three or more rotating abrasive surface plates 41a, 41b, and 41c being rotating and provided with abrasive cloth 13 on the surface; wafer holding heads 42a, 42b, and 42c being rotating while pushing the surface of a wafer 100 to the cloths 13; and wafer carrying mechanisms 43 and 47 for delivering unground or ground wafers among the heads 42a, 42b, and 42c. In this case, three or more abrasive surface plates are arranged rectilinearly, the heads are provided corresponding to the respective surface plates, and the delivering of the wafers between the heads and the mechanisms is made at positions corresponding to the respective surface plates. |
