| 摘要 |
<p>An adhesive composition preferably for use in bonding of electronic parts on a board, said composition comprising: a) 12.0-18.0 weight % of a first resin, said first resin being a cross-linkable clathrate matrix resin; b) 8.0-22.0 weight % of a particulated filler; c) 15.0-30.0 weight % of a cross-linking agent capable of cross-linking said first resin; d) 1.5-3.5 weight % of a second resin, said second resin being an olygodieneurethane resin with the end oxymethyloxazolidone groups, said second resin having general chemical formula ##STR1## p=17-31, k=8-15, e) 35.0-60.0 weight % of an organic solvent.</p> |
