| 摘要 |
PURPOSE:To evaluate electric characteristics between lead terminals in an IC mounted onto a substrate easily by forming a lead terminal electrically connected to another lead terminal projecting from the side surface of a package on an upper surface. CONSTITUTION:Second lead terminals 13 electrically connected to lead terminals 12 projecting from the side surface of an IC package 11 are mounted to the upper surface of the package 11 besides the lead terminals 12. A tester bar 5 may be brought into contact with the second lead terminals 13 on the evaluation of electric characteristics, and contacts with other IC terminals adjacently set up can be avoided easily. The second lead terminals 13 need not be projected in size longer than the upper surface of the package 11 because the tester bar 5 may be able to be brought into contact with them.
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