发明名称 |
Multi-chip module |
摘要 |
A multi-chip module is provided with a structure for disposing of a large amount of surplus solder at soldered portions. In this multi-chip module, a cooling member (structure) is soldered directly at the back side of heat generating member such as a semiconductor integrated circuit element. In order to dispose of the surplus solder, the present invention has a first metallized part formed at a cooling member which is larger than a second metallized part formed at the back side of semiconductor integrated circuit element which is soldered with the first metallized part. <IMAGE> |
申请公布号 |
EP0997938(A2) |
申请公布日期 |
2000.05.03 |
申请号 |
EP19990305307 |
申请日期 |
1999.07.05 |
申请人 |
HITACHI, LTD. |
发明人 |
NISHIKAWA, TORU;HARADA, MASAHIDE;KATAYAMA, KAORU;MIITSU, TAKESHI;UDA, TAKAYUKI;DAIKOKU, TAKAHIRO |
分类号 |
C04B41/88;H01L23/36;H01L23/433 |
主分类号 |
C04B41/88 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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