| 摘要 |
Wallboard tape and compound are simultaneously dispensed through an applicator which is provided with a pressurized reservoir which acts as a fluid capacitor to ensure an even application of compound to the tape, even under intermittent and uneven tape application rates. Applicator nozzles are provided for applying the tape and compound to flat surfaces as well as to corner joints. Compound is wiped from the edges of the tape and the remaining compound is subsequently spread laterally to these wiped edge areas so that no excess compound is extruded from under the tape, thereby avoiding subsequent wiping and clean-up procedures.
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