STORAGE-STABLE HEAT-CURABLE MIXTURES AND THE USE THEREOF

摘要

Storage-stable heat-curable mixtures and the use thereof Storage-stable heat-curable mixtures are described which contain A) a polyimide which contains in the molecule at least two radicals of formula I (I) wherein D is a divalent radical with a C=C double bond, B) an alkenylphenol, C) an epoxide group-free adduct of an epoxy resin with excess alkenylphenol or D) a polyimide which is soluble in organic solvents or a mixture of C) and D). These mixtures are employed for example as laminating resins or electro-resins, as adhesives or adhesive films for application at high temperatures, or for the preparation of coatings.