MULTY LAYER CERAMIC LEADLESS PACKAGE AND CONNECTOR FIXED ON PRINTED CIRCUIT BOARD THEREOF

摘要

The package comprises laminating a first green sheet (1), a second green cheet (2) having a hole (8) and a third green sheet (3) having a hole (8'), and inserting a semiconductor chip (7) in the holes (8,8'). Through holes (1a)(1b) are perforated through the edge of the green sheets (1)(3). The inner terminals (5)(5') of a conduction wiring are printed on the upper and botton sides of the green sheets (1)(2)(3). The leadless package (12) is coupled with a connector (9) and contacted on a printed circuit board (10) having a cuter terminal (6'). Accordingly, the botton surface of the package is directly contacted with a heat tank (11) to improve the radiation of heat.