| 摘要 |
PROBLEM TO BE SOLVED: To process the end part of a wafer by a simplified device. SOLUTION: This device is provided with a table 2 to rotate by sucking and holding a wafer 3; a unit holding member 6 provided at the upper side of the table 2; a linear shaft 11 provided movable up and down to the unit holding member 6; a pad holder 14 provided at the lower end of the linear shaft 11 through a spherical bearing 13; a ring form pad 20 fixed to the pad holder 14 corresponding to the end of the wafer 3; a cylinder 31 provided to the unit holding member 6, to press the pad holder 14, and a specific pressure to press the wafer 3 by the pad 20 is applied; and a cylinder 33 to feed a slurry on the wafer 3 at the inner side of the pad 20. |
