发明名称 |
Electronic stack module |
摘要 |
An electronic stack module is disclosed comprising two or more substrates having upper and lower surfaces with one or more electronic components disposed on the surfaces and electrically connected to connector pads disposed in a predetermined pattern at the substrate edges. A plurality of clip leads are electrically attached to the connector pads, where each clip lead comprises a clip section, a standoff section of specified length, and a mounting section, the clip section configured to frictionally engage both upper and lower substrate surfaces. Stacking of substrates is accomplished by aligning and bonding clip sections of one substrate to corresponding mating sections of the adjacent substrate.
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申请公布号 |
US5910885(A) |
申请公布日期 |
1999.06.08 |
申请号 |
US19970984001 |
申请日期 |
1997.12.03 |
申请人 |
WHITE ELECTRONIC DESIGNS CORPORATION |
发明人 |
GULACHENSKI, ALAN M.;PRAINO, JOSEPH;SEIDLER, JACK |
分类号 |
H01L25/10;H01R12/04;H05K1/14;H05K3/32;H05K3/34;H05K3/36;(IPC1-7):H01R9/09;H01R4/02 |
主分类号 |
H01L25/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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