| 摘要 |
An electronic device (10) has a plurality of capacitors (16a, 16b, and 16c) in an ultra-small integrated package. The device (10) has a plurality of terminal structures (18a, 18b and 18c) on one terminal side of the package to permit inverted mounting to a printed circuit board (12). The terminals (18a, 18b and 18c) are widely spaced, with the individual capacitors (16a, 16b and 16c) being located entirely in between. The device is produced on a suitable substrate (26) using thin film manufacturing techniques. A lead-based dielectric (32) having a high dielectric constant is preferably utilized for each capacitor to provide a relatively high-capacitance value in a relatively small plate area. |
