| 摘要 |
<p>The present invention provides a thermosetting resin composition useful as an underfilling sealant composition which (1) is capable of shrinking when cured, (2) rapidly fills the underfill space in a semiconductor device, such as a flip chip assembly which includes a semiconductor chip mounted on a carrier substrate, (3) enables the semiconductor to be securely connected to a circuit board by short-time heat curing and with good productivity, and (4) demonstrates excellent heat shock properties (or thermal cycle properties). The thermosetting resin compositions of this invention which are used as underfill sealants between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, include broadly (a) an epoxy resin component; (b) a (meth)acrylate resin component; (c) an inorganic filler component; and (d) a polymerization catalytic component.</p> |
