WAFER SAWING METHOD USING A PROTECTION TAPE

摘要

PURPOSE: A method for sawing a wafer is provided to prevent a damage of surface of wafer and simplify the manufacturing process by using a protection tape. CONSTITUTION: The wafer sawing method comprises the steps of a step(210) of bonding a mount tape(330) on a rear surface(314) of wafer formed a plurality of semiconductor chips(320); a step(220) of bonding a protection tape(340) on the front surface(312) of the wafer; a step(230) of rotating a blade(352) of cutter; a step(240) of sawing the semiconductor chips(320) to unit chip by moving the wafer(310) to X-Y axis; and a step(250) of removing the sawed protection tape(340) from the surface(312) of the wafer, thereby protecting the surface of the wafer from particles generated in the sawing step.