| 摘要 |
PURPOSE:To maintain a positioning accuracy of a high level and to realize a packaging of a low cost by providing a positioning reference hole of a solid- state image pickup element on a lead frame placed on a ceramic package. CONSTITUTION:Lead frames 12A, 12B with a tab provided with positioning reference holes 12a, 12b, respectively are fixed between a ceramic frame 11A having pierced holes 11a, 11b on both end sides, respectively, and a ceramic frame 12B having equal pierced holes to the holes 11a, 11b, so that the center axes of the pierced holes 11a, 11b and the reference holes 12a, 12b coincide with each other. In this case, a solid-state image pickup element 4 is brought to die bonding onto a tab 12c of the lead frame basing on the holes 12a, 12b of the lead frames 12A, 12B, and it is placed so as to coincide with an optical axis of an optical system of a camera. In this way, positioning of high accuracy of the element 4 is executed. |
