| 摘要 |
A method and an apparatus for cutting a laminate made of a brittle material and a plastic with a cutting tool is described. The plastic is heated up, thereby lowering its viscosity, at least in the region of a predetermined cutting line. A cutting tool is placed onto the plastic side of the laminate, the loading pressure being adjustable. By moving cutting tool relative to the laminate along the predetermined cutting line, the plastic is severed; at the same time the brittle material is scored, thereby inducing a mechanical stress. If appropriate, the mechanical stress along the cutting line is subsequently increased to exceed the rupture strength of the scored brittle material. A preferred application is the cutting of thin glass or glass-ceramic/plastic laminates.
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