| 摘要 |
PROBLEM TO BE SOLVED: To provide a heating device for eliminating factors regarding the packaging position deviation of an optical semiconductor element caused by the thermal expansion of a ceramic heater body by allowing the packaging position of the optical semiconductor element to coincide with the thermal expansion center of the ceramic heater body, and to provide the packaging method of the optical semiconductor element using the heating device. SOLUTION: The heating device H comprises the flat ceramic heater body 12, and a substrate 10 for heating for fixing the optical implementation substrate for implementing the light semiconductor element while being arranged on the ceramic heater body 12, and has a heating temperature distribution that is nearly symmetrical to the heating center P of the substrate 10 for heating.
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