METHOD FOR CLEANING WAFER

摘要

PROBLEM TO BE SOLVED: To reduce particles on a wafer surface surely in a shot time. SOLUTION: A method for cleaning a wafer for cleaning the surface of a semiconductor wafer after finish polishing, comprises a first ozone water cleaning process or forming an oxide film comprising a plurality of layers by ozone water cleaning, a mechanical cleaning process for brush cleaning the wafer surface after the first ozone water cleaning process, a hydrofluoric acid solution cleaning process or exfoliating so that only one layer of a wafer surface side is left by cleaning the oxide film formed on the wafer surface with hydrofluoric acid solution, and a second ozone water cleaning process for further forming the oxide film by the ozone water cleaning to the wafer surface after finishing the hydrofluoric acid solution cleaning.