| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing method which can prevent air from being caught into a sealing resin when clamping a mold, and its resin sealing equipment. SOLUTION: The resin sealing method is carried out in a manner such that the sealing resin is filled into a recess formed on a lower mold using a mold having an upper mold and a lower mold, an electronic component is set on the upper mold, and the resin sealing of the electronic component is performed by clamping the mold. In addition, the resin sealing method is carried out in a vacuum, and the mold is clamped at a low speed that can prevent an air bubble from being caught into the sealing resin. COPYRIGHT: (C)2007,JPO&INPIT |
