PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

A printed circuit board and a method for manufacturing the same are provided to prevent a peel-off phenomenon and to minimize a generation of a gap between a circuit pattern and an insulation substrate by an etching deviation in an etching process after removing a carrier plate. A method for manufacturing a printed circuit board includes the steps of: forming protrusively a circuit pattern on a surface plane of a carrier plate(S10); forming a seed layer by plating a surface of the carrier plate(S11); stacking a plating resist on the carrier plate(S12); forming an opening unit to expose a part of the carrier plate by removing selectively the plating resist corresponding to the circuit pattern(S14); forming the circuit pattern by growing a plating layer to cover a part of the plating resist and be charged in the opening unit(S16); removing the plating resist(S18); burying the circuit pattern on an insulation substrate by compressing the carrier plate on the insulation substrate(S20), wherein the circuit pattern has a cross section of an arrow head shape which is formed to be extended along a length direction.