发明名称 CONDUCTIVE PASTE COMPOSITION AND PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste composition in which there is less clogging of screen meshes at printing, and in which a printing pattern by the conductive paste composition can be formed precisely and clearly. SOLUTION: This is the conductive paste composition containing a binder resin, conductive powders, and a curing agent, the conductive powders have the average particle diameter of 0.5 to 10μm, and existence ratio of the conductive powders of particle diameters of 40 to 50μm is 300 ppm or less against the total amount of the conductive powders. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008047487(A) 申请公布日期 2008.02.28
申请号 JP20060224175 申请日期 2006.08.21
申请人 THE INCTEC INC 发明人 USUKI NAOMI
分类号 H01B1/22;H01B1/00;H05K1/09 主分类号 H01B1/22
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