| 摘要 |
PROBLEM TO BE SOLVED: To provide a transfer molding device capable of detecting a pressure pressurizing a resin for each plunger, also executing the clearance management of the plungers, the management of the progress of stains, the result evaluation of exchange components and work, etc., by periodically detecting a plunger slide resistance value and obtaining maintenance information, and improving the quality management of products and traceability as a result, and to provide a manufacturing method of a semiconductor device using it. SOLUTION: The transfer molding device relating to this invention is provided with a pot communicated to a cavity and the plurality of plungers slid inside the pot, has a transfer unit for supporting the plungers and a drive mechanism for vertically moving the transfer unit, and fills the resin into the cavity by pressurizing the resin housed inside the pot by the plungers. In the transfer molding device, a pressure sensor for detecting the pressure acting on the plunger is provided for each of the plurality of plungers. COPYRIGHT: (C)2009,JPO&INPIT |
