| 摘要 |
<p>A plating machine comprising a plating unit and a control unit which are installed in separate rooms so that works which are the dirty polluting ones of maintenance are conducted in the room where the control unit is installed as much as possible, and thereby works for maintenance of the plating unit are reduced to a minimum not to cause any problem of pollution from the plating unit. The plating machine has the plating unit for plating and the control unit for, e.g., adjusting a plating solution is characterized in that the plating unit contains the plating solution and includes a plating bath for plating where an anode electrode faces an object to be plated, serving as a cathode, the control unit includes an adjusting bath for adjusting the components and/or concentration of the plating solution and a solution supplying mechanism for adding a replenisher solution to the plating solution in the adjusting bath, the plating machine further has a solution circulating mechanism for circulating the plating solution through the adjusting bath of the control unit and the plating bath of the plating unit, the plating unit is installed in a first room, and the control unit is installed in a second room.</p> |
