发明名称 Wiring board
摘要 A wiring board includes multiple insulating layers including first, second, third, fourth and fifth insulation layers laminated in the order of the first, second, third, fourth and fifth insulation layers. The first insulation layer has a first conductor including plating, the second insulation layer has a second conductor including plating, the third insulation layer has a third conductor including conductive paste, the fourth insulation layer has a fourth conductor including plating, the fifth insulation layer has a fifth conductor including plating, and the first conductor, the second conductor, the third conductor, the fourth conductor and the fifth conductor are formed along the same axis and are electrically continuous with each other.
申请公布号 US9425137(B2) 申请公布日期 2016.08.23
申请号 US201414552771 申请日期 2014.11.25
申请人 IBIDEN CO., LTD. 发明人 Naganuma Nobuyuki;Takahashi Michimasa;Aoyama Masakazu
分类号 H01L23/053;H01L23/12;H05K1/11;H01L23/498;H01L23/538;H05K3/46;H05K1/02;H05K1/09;H05K1/18;H05K3/00;H05K3/40 主分类号 H01L23/053
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P
主权项 1. A wiring board, comprising: a plurality of insulating layers comprising a first insulation layer, a second insulation layer, a third insulation layer, a fourth insulation layer and a fifth insulation layer laminated in an order of the first insulation layer, the second insulation layer, the third insulation layer, the fourth insulation layer and the fifth insulation layer, wherein the first insulation layer has a first hole which penetrates through the first insulation layer and includes a first conductor comprising a plating formed in the first hole in the first insulation layer, the second insulation layer has a second hole which penetrates through the second insulation layer and includes a second conductor comprising a plating formed in the second hole in the second insulation layer, the third insulation layer has a third hole which penetrates through the third insulation layer and includes a third conductor comprising a conductive paste filled in the third hole of the third insulation layer, the fourth insulation layer has a fourth hole which penetrates through the fourth insulation layer and includes a fourth conductor comprising a plating formed in the fourth hole in the fourth insulation layer, the fifth insulation layer has a fifth hole which penetrates through the fifth insulation layer and includes a fifth conductor comprising a plating formed in the fifth hole in the fifth insulation layer, and the first conductor, the second conductor, the third conductor, the fourth conductor and the fifth conductor are formed along a same axis and are electrically continuous with each other; a first land connected to the second conductor and the third conductor and formed in the third insulation layer; and a second land connected to the third conductor and the fourth conductor and formed in the third insulation layer, wherein the first land has a recess formed in a central portion of the first land, the second land has a recess formed in a central portion of the second land, and the conductive paste is filled in the recess of the first land and the recess of the second land.
地址 Ogaki-shi JP