Casing for optical semiconductor sensor, comprises focusing unit, transparent plate and casing

摘要

Focusing unit, transparent plate and casing comprise the same material, or materials of near identical thermal expansion coefficient. Insulating casing (1) including basal openings (1a, 1b), has a lead frame (3) reaching through it. The optical semiconductor chip (2) is fixed to the base of the casing and has surface pads connected (4) to the lead frame. The interior is transparently filled (7). The openings absorb expansion or contraction of the filler. A transparent plate (5) is arranged over filler and chip, adhered or welded to the casing. A focusing unit (6) is adhered or welded to the plate, located to focus images on the chip. Focusing unit, transparent plate and casing comprise the same material, or materials of near identical thermal expansion coefficient.