| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition particularly suited for permanent resists having high resolution, easy developability, solvent resistance, plating solution resistance, and soldering-heat resistance in the production of printed wiring boards by mixing an epoxy resin with a cationic photopolymerization initiator. SOLUTION: An epoxy resin (A) of the formula is used, The cationic photopolymerization initiator (B) used is exemplified by an aromatic iodonium salt or an aromatic sulfonium salt. It is desirable that an organoaluminum compound (C) is used. it is also possible that a sensitizer (D) is used. It is desirable that the composition comprises 90-99.5 wt.% component A and 0.5-10 wt.% component B (the total amount of components A and B is 100 wt.%). It is also desirable that 0-10 pts.wt. component C and 0-10 pts.wt. component D are used per 100 pts.wt. total amount of components A and B. |
