发明名称 Housing-free vertically insertable single-in-line circuit module
摘要 A housing-free, vertically insertable single-in-line circuit module has a carrier consisting of synthetic film or ceramic which carries a series of metal terminal pins and one or more electrical components including at least one integrated semiconductor circuit element, and associated conductor runs connecting the circuit element to the terminals, and the carrier has one lateral face thereof which is substantially covered by a metallic cooling sheet for permitting improved cooling of the circuit module by convection.
申请公布号 US4689719(A) 申请公布日期 1987.08.25
申请号 US19850724491 申请日期 1985.04.18
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 PRUSSAS, HERBERT;STERN, PETER
分类号 H05K1/05;H05K1/14;H05K3/00;H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K1/05
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