| 摘要 |
PURPOSE: An epoxy resin composition for encapsulating semiconductors is provided which has the advantage of restraining the occurrence of cracks of semiconductor devices. CONSTITUTION: A composition comprises an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler, wherein it contains a polybutadiene having a free transition temperature of 70 to 90°C additionally. The content of the polybutadiene is 0.5 to 5.0 parts by weight based on 100 parts by weight of the total amount of the epoxy resin. The composition is excellent in adhesive strength to a lead frame and low in moisture adsorption so that it may provide semiconductor devices excellent in crack resistance when applied to resin-sealed semiconductor devices. |
