| 摘要 |
PROBLEM TO BE SOLVED: To provide a module for an IC card with improved strength against a pressure applied to an IC chip. SOLUTION: In this module 1 for the IC card forming the main part of the IC card provided with a substrate 2 and the IC chip 3 mounted on the substrate 2 by bumps 4, a projected line 32 for reinforcing the IC chip 3 is formed by a resin material on the side face of the bumps 4 of the IC chip 3 and the height of the projected line 32 is the same as the height of the bumps 4. |
