| 摘要 |
<p>PROBLEM TO BE SOLVED: To efficiently remove fine grains on a wafer surface by forming an opening at a part inclined for holding a wafer so that the transmission of a sonic wave can be made uniform. SOLUTION: This device is provided with a plurality of supply piping parts positioned at the opposite side to a drain piping part positioned at a sink stand 30 so that the water circulation of an ultrasonic wave cleaning device can be made constant. A cassette 46 is constituted so that a plurality of semiconductor wafers 48 can be loaded inside in the configuration of a square pole. A side wall 40 of the square pole and a corresponding side wall 42 are made flat from the upper part to the constant part of the lower part. A lower stage part 44 being the remaining part at the lower part is inclined at a constant angle, and this part is provided with an opening (an area to which a fine dot is applied). Therefore, the sonic wave can be evenly transmitted to the wafer 48 loaded inside the wafer cassette 46, and the uniform removal of fine grains existing as a whole on the wafer 48 can be attained.</p> |
