| 摘要 |
<p>The procedure for mfr. of a card containing a semiconductor chip circuit includes covering one surface of paper with a self-adhesive layer which is resistant to high temperatures. This layer is covered by a protective layer. This paper is then introduced into an electrostatic printing machine where the required design is applied to the un-coated side of the paper. The area of paper carrying the design is cut to the size of a label surrounding the design. An electronic module is formed containing a chip in a cavity and this is attached to the paper sheet once the protective layer has been removed from the self-adhesive layer on one side. The printing process may be a four-colour electrostatic printing process.</p> |
