Polyimide resin composition

摘要

PCT No. PCT/JP93/00515 Sec. 371 Date Feb. 16, 1994 Sec. 102(e) Date Feb. 16, 1994 PCT Filed Apr. 21, 1993 PCT Pub. No. WO93/21277 PCT Pub. Date Oct. 28, 1993A polyimide resin composition comprising 50-95 parts by weight of a polyimide resin represented by the following formula (1): <IMAGE> (1) wherein X represents a direct bond, a hydrocarbon group, a carbonyl group, a thio group or so, Y1-Y4 individually represent a hydrogen atom, a lower alkyl group or so and R1 represents an aliphatic group, an aromatic group or so; and 50-5 parts by weight of a polyetheretherketone, said composition having been subjected to heat treatment at 250 DEG -330 DEG C. and, after the heat-treatment, having crystallization enthalpy of 0-6 cal/g. The heat treatment of the polyimide resin composition can be effected at a low temperature in a short time. The polyimide resin composition has excellent dimensional stability and high-temperature physical properties. Moreover, it has excellent moldability and peeling resistance.