发明名称 POLYAMIDE 4.6 COMPOSITION
摘要 The invention relates to a polyamide composition containing polyamide 4.6, at least one other polyamide that is at least partly immiscible with polyamide 4.6, and a copolyamide. The invention also relates to a polyamide composition with a block copolyamide of polyamide 4.6 and at least 2 other polyamides. The composition has a high melting point and also a high elongation at break. The properties can be improved further by a heat treatment. Film obtained with the composition exhibits a reduced permeabililty to oxygen and is suitable as, inter alia, protective film for instruments packed in in-situ foamed polyurethane and as film for flexible printed circuit boards.
申请公布号 EP0809676(A1) 申请公布日期 1997.12.03
申请号 EP19960904345 申请日期 1996.02.12
申请人 DSM N.V. 发明人 SCHEETZ, HOWARD, A.;KOENEN, JACOB
分类号 C08L77/00;C08L77/02;C08L77/06;H05K1/03 主分类号 C08L77/00
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