发明名称 |
Chemical-mechanical polishing of semiconductor wafers |
摘要 |
A chemical mechanical polishing process in a wafer is polished with slurry under selected operating conditions for a first time period that avoids overpolishing; and then polished with DI water under the selected operating conditions for a second time period until the surface of the wafer is substantially planar and dishing is minimized. The process can be used in conjunction with a damascene or dual-damascene process in which tungsten is polished with respect to BPSG.
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申请公布号 |
US6008119(A) |
申请公布日期 |
1999.12.28 |
申请号 |
US19970940762 |
申请日期 |
1997.09.30 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FOURNIER, BERNARD |
分类号 |
H01L21/321;H01L21/768;(IPC1-7):H01L21/476 |
主分类号 |
H01L21/321 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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