Micromechanical component, e.g. an acceleration or revolution speed sensor, is produced by local sacrificial oxide etching while leaving a reserve region which is removed during subsequent partial substrate removal

摘要

A micromechanical component production process, in which a reserve region is left during local sacrificial oxide layer etching but is removed during subsequent partial substrate removal, is new. Production of a micromechanical component, having a mobile surface structure spaced from an underlying silicon substrate (10), comprises: (a) locally etching a sacrificial oxide layer (12) to form the space, while leaving a reserve region; and (b) removing a substrate region below free sections of the surface structure, together with the reserve region.