SILICON NITRIDE COMPOSITE SUBSTRATE

摘要

An Si3N4 ceramic composite substrate not cracking even if a mechanical or thermal shock is given to it and excellent in heat-radiation and heat-cycle-resistance characteristics. The Si3N4 substrate has a heat conductivity of more than 90 W/m. K, and a three-point flexural strength of more than 700 MPa. The relationship between the thickness tm of a metallic layer joined to a major surface of the Si3N4 substrate and the thickness tc of the Si3N4 substrate is given by 2 tm