| 摘要 |
PROBLEM TO BE SOLVED: To enhance the provability of the existence of conductive particles which contribute to the connection and materialize a favorable chip connection, by thermally pressure-bonding minute metallic particles to the tip of a salient electrode, thereby increasing the area of the tip plane. SOLUTION: A salient electrode 12 is made at the electrode 11 of an LSI chip 10 by a ball bonding of gold wire. For the salient electrode 12 made by ball bonding, the tip is not flat, and proper connection reliability cannot be obtained, when it is connected to its opposite board via conductive particles, using an anisotropic conductive film. Therefore, metallic particles 21 with diameter larger than that of gold wire or metallic particles 22 smaller in diameter than the gold wire are jointed to the tip of the salient electrode 12. Hereby, the connection reliability can be improved by flattening the tip of the salient electrode. |
