| 摘要 |
PURPOSE:To solve the problem of heat resisting and moisture resisting insulation so as to obtain a highly reliable multilayered circuit board by using a hardening polyphenylene ether resin composition as the interlayer insulating material of the circuit board. CONSTITUTION:This multilayered circuit board is constituted by piling up multiple circuit boards 4 respectively formed of conductors 2 on both sides of an insulating substrate 1 with interlayer insulating layers 3 in between. A hardening polyphenylene ether resin or a combination of the resin and another insulator can be used for the layers 3. It is preferable to use copper for the conductor especially from the viewpoints of the conductivity and economy. It is also preferable to use a hardening polyphenylene ether resin as the overcoat material formed as required. A hardening polyphenylene ether resin composition composed of a polyphenylene ether resin containing an unsaturated group, triallyl isocyanurate and/or triallyl cyanurate, and flame retardant is used as the hardening polyphenylene ether resin. |
