| 摘要 |
PROBLEM TO BE SOLVED: To properly restrain stress from concentrating on a joint between a wire and an inner lead or between a wire and a semiconductor chip when a semiconductor chip and plural inner leads inside a resin package are electrically connected together with a wire. SOLUTION: This device 1 is composed of a semiconductor chip 3, inner leads 50 electrically connected to the chip 3 via wires 4, a resin package 6 which is formed so as to enclose the chip 3, the wires 4, and the leads 50, and outer connection terminals 51 provided to be electrically connected to the inner leads 50 outside the package 6. In this case, at least one of joints between the inner leads 50 and the wires 4 is sealed up with a resin 7a. It is preferable that the thermal expansion coefficient of the resin 7a which seals up a joint between the inner lead 50 and the wire 4 be set larger than that of the inner lead 50, but smaller than that of the resin package 6. |
