| 摘要 |
PROBLEM TO BE SOLVED: To inexpensively and highly reliably conduct double-face wiring patterns on a printed wiring board, without deteriorating productivity for realizing high density mounting. SOLUTION: This flat part 12 of a conduction part 10a is absorbed and held by a surface mounting part installation machine, and the part is installed on a printed wiring board main body 1 by using the conduction part 10a provided with a flat part 12, that can be absorbed/held by the surface mounted part installation machine, a lead part 13 which can be inserted into a through- hole 8 formed in the printed wiring board main body 1 and a joint part 14 jointed to a land formed on a side A of the printed wiring board main body 1. The double faces of the printed wiring board main body 1, to which the conduction part 10a is installed, are soldered, and therefore the land 4 formed on the side A of the printed wiring board main body 1 is jointed to the joint part 14 of the conduction part 10a. Then, the lead part 13 is jointed with a land 5 formed at the periphery of the through-hole 8 on the side B of the printed wiring board main body 1. |
