| 摘要 |
PROBLEM TO BE SOLVED: To provide a mask for filling a resin with which a supporting sheet can be prevented from being damaged easily and a resin filler does not permeate into the rear surface of a plate even when used for filling the resin filler. SOLUTION: In manufacturing a multilayer printed wiring board, the mask is used for filling the filler inside a through hole formed on the board and/or a recessed part on the board on which a lower layer conductor circuit is formed and the recessed part is formed on a lower layer conductor circuit non-formation part. The mask consists of a plate having an opening, a supporting sheet for supporting the plate in the surroundings thereof and a frame for supporting the sheet from the surroundings thereof, and the plate has an area rate of 0.2-0.6 to the total area of the plate and the sheet. |
