| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device that has a shielding means for reducing cross talk between internal wires by which a lead 2 and an electrode pad 4 of a semiconductor chip 1 are connected, and to obtain a method by which the shielding means can be easily manufactured. SOLUTION: After having connected one end of a metal fine wire 3a to the electrode pad 4, a nozzle unit 6 is provided which forms an insulating coating and a conductive coating by coating the metal fine wire 3a with a first resin member 10 and a conductive member 9, interlocking with a rising capillary 7 and the wire having a shield structure is formed. |
