| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a buildup multilayer wiring substrate for preventing wiring breakages due to via bottom exfoliation so as to enhance the mount reliability, and to provide a semiconductor device, and a manufacturing method of them. <P>SOLUTION: The multilayer wiring substrate 10 is configured such that a plurality of wiring layers 12, 17 and insulation layers 11a, 11b and 11c are alternately laminated and the wiring layers are interconnected through via-holes 16, 19. The end face of the first wiring layer 12 is directly connected to a side wall face of the via-hole 16 integrally configured with the second wiring layer 17 located at the upper layer side of the first wiring layer to make the first wiring layer 12 conductive to the second wiring layer 17. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
