| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a foaming ink capable of readily and surely carrying out conductive connection between printed circuit boards and performing miniaturization and cost cut of an electronic device, and the printed circuit board using the foaming ink. <P>SOLUTION: The foaming ink 1 is obtained by mixing a paste-like ink agent 2 having a thermosetting material and a conductive material with a foaming agent 3 having a heat-expandable property, and the foaming ink 1 comprises 1-5 wt.% of the foaming agent 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
