| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To increase the bonding strength between a printed board and a connecting member by using the chemical bonding ability of an adhesive itself and the anchor effect, and to thereby secure sufficient shock resistance to an external force such as dropping. <P>SOLUTION: A circuit pattern 31 is formed on the printed board 3. A surface of a plating 2 of a protrusion 10a of a base body 10 is connected to the circuit pattern 31 by solder 4. Then, an adhesive 5 is injected into a gap between a roughened surface of a non-circuit portion 10b and the printed board 3. Upon injection of the adhesive 5 into the gap, the adhesive 5 enters into an uneven portion of the non-circuit portion 10b having the roughened surface, and hardens inside the recessed portion, thereby generating the anchor effect in addition to the chemical bonding ability of the adhesive itself. This enhances the fixing strength and the bonding strength. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
