发明名称 DISPERSION OF INORGANIC COMPOUND IN RESIN, MOLDING PELLET AND MOLDING
摘要 PROBLEM TO BE SOLVED: To obtain a dispersion of inorganic compounds in resins excellent in dispersibility which can provide thermoplastic resin moldings excellent in transparency, shielding of specified wave length, mechanical properties and appearance. SOLUTION: The dispersion of inorganic compounds in resins comprises a metal oxide (A) having a primary particle size of 0.1μm or less, a metal sulfate (B) having a primary particle size of 0.1μm or less, a reactive silicone (C) and a thermoplastic resin (D). The molding pellets can be obtained by melting and kneading the dispersion. The moldings can be obtained by using the dispersion of inorganic compounds in resins or the molding pellets. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005232334(A) 申请公布日期 2005.09.02
申请号 JP20040043892 申请日期 2004.02.20
申请人 TOYO INK MFG CO LTD 发明人 KAWAMURA MASAYASU;OI SATOSHI;KOIDE MASASHI
分类号 C08L101/00;C08K3/22;C08K3/30;C08L83/04;(IPC1-7):C08L101/00 主分类号 C08L101/00
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