| 摘要 |
PROBLEM TO BE SOLVED: To facilitate a wiring design between a chip and a terminal and to improve a wiring characteristic by arranging interface circuits in a main chip in peripheral center parts in the main chip. SOLUTION: Interface circuits 4 in a main chip 2 are dispersed and arranged in the centers of four peripheral sides in the main chip 2. Thus, IP chip connection terminals 5 are dispersed and arranged in the centers of the four outer peripheries of the main chip 2 in accordance with the interface circuits 4. The wiring areas of an IP chip bonding terminal and the IP chip connection terminals 5 are dispersed in the respective peripheries of an IP chip 3 at the back of a mounting substrate 1. Thus, a wiring relation between main chip connection terminals 6 and MCP chip terminals becomes short in terms of distance and wiring becomes easy. Consequently, the dispersion of a wiring distance is suppressed, wiring length is shortened, the congestion of wiring is relieved and the area of the wiring area is reduced. |
