Method of embedding semiconductor element in carrier and embedded structure thereof

摘要

A method of embedding a semiconductor element in a carrier and an embedded structure thereof are proposed. First, a carrier having a hole is provided and an auxiliary material is attached to a side of the carrier. A semiconductor element is placed in the hole of the carrier. Then, a medium material and glue are applied in order in the hole to firmly position the semiconductor element in the hole of the carrier via the glue. Finally, the auxiliary material and the medium material are removed to form a structure with the semiconductor element being embedded in the carrier, thereby eliminating the drawbacks encountered in packing the semiconductor element in the prior art.