发明名称 |
SCRAP ELIMINATION APPARATUS |
摘要 |
<p>Disclosed is a scrap elimination apparatus of a sawing machine used for fabricating semi¬ conductor devices. The scrap elimination apparatus includes a guide duct for receiving and guiding the scraps, and a scrap discharge unit installed at a bottom surface of the guide duct in order to discharge the scraps while floating the scraps. The scraps introduced into the guide duct are discharged by the fluid, which upwardly sprays toward the scraps through the fluid spray holes, so the scraps are prevented from sticking to the guide plate or being embedded or caught in the pulley during the discharge process for the scraps. Thus, it is possible to easily discharge the straps without stopping the operation of the scrap elimination apparatus.</p> |
申请公布号 |
WO2006062307(A1) |
申请公布日期 |
2006.06.15 |
申请号 |
WO2005KR04044 |
申请日期 |
2005.11.29 |
申请人 |
HANMI SEMICONDUCTOR CO., LTD.;JUNG, HYUN-GYUN;KWAK, NHO-KWON |
发明人 |
JUNG, HYUN-GYUN;KWAK, NHO-KWON |
分类号 |
H01L21/301 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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